You are here

Distinguished Seminar: Bruce Geil

Tuesday, March 5, 2019, 4:00 pm

Join The Ohio State University Department of Electrical and Computer Engineering (ECE) for a special seminar by Dr. Bruce Geil from the Army Research Laboratory. 

Details: 

Tuesday, March 5, 2019 4-5 p.m. 

Dreese Lab 260 (Coffee and cookies provided)

Title:

 “Research Into and Solutions for Army Energy and Power Challenges”

ABSTRACT:
This seminar will focus on the challenges the Army faces in providing, converting and distributing energy and power for the soldier. Following a brief description of the challenges that are facing the Army the presentation will focus on ARL research to provide solutions. The seminar will cover three key power conversion research areas in wide bandgap devices, advanced power modules, and power conversion and distribution for both continuous and pulsed applications. Wide bandgap device work that ARL has been involved with over 2 decades will be presented along with the future direction this work is taking to provide high voltage capabilities. This will be followed by a description of recent work in high power module research that is focused on fast parametric analysis tools, thermal management techniques and co-engineering/co-design. Finally the presentation will cover work in conversion and distribution technologies at the component level for both continuous and pulse power applications.

BIO:
Mr. Geil is currently the chief of the Power Integration branch in the Energy and Power division at the Army Research Laboratory the Army’s corporate research laboratory. The branch’s primary focus is semiconductor devices, power electronics packaging, and conversion and distribution technologies to improve the performance of electrical power conversion and distribution systems for
Army applications including tactical and, platform power, and pulse and high voltage capabilities for survivability, lethality, and sensing applications. The branch has been a leading proponent in developing wide band gap SiC technology for power switching applications and works closely with the industry, academia and other government agencies to improve performance and reduce costs through advanced material and device technologies. Mr. Geil has 35 years’ experience at the Army Research Laboratory, in the design, fabrication and packaging of semiconductor devices and holds a Bachelor of Science degree in mechanical engineering from the University of Maryland Baltimore County and a Master’s degree in electrical engineering from the University of Maryland. His primary
areas of research before becoming branch chief included MEMS device development for power systems, wide band gap device fabrication, high temperature packaging technologies, and thermal management for power modules. In 2006 Mr. Geil deployed to Iraq to evaluate operational power requirements and performance of ARL developed technologies.